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Volumn 382, Issue 1-2, 2004, Pages 305-314

Locus of failure between a nanowire-coated leadframe and an epoxy-based molding compound

Author keywords

Adhesion; CuO nanowire; Epoxy; Failure path; Leadframe; Oxidation

Indexed keywords

COATING TECHNIQUES; COPPER; FAILURE (MECHANICAL); LEAD; NANOSTRUCTURED MATERIALS; SHEET METAL;

EID: 4444324166     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.05.018     Document Type: Article
Times cited : (3)

References (33)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.