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Volumn 382, Issue 1-2, 2004, Pages 305-314
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Locus of failure between a nanowire-coated leadframe and an epoxy-based molding compound
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Author keywords
Adhesion; CuO nanowire; Epoxy; Failure path; Leadframe; Oxidation
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Indexed keywords
COATING TECHNIQUES;
COPPER;
FAILURE (MECHANICAL);
LEAD;
NANOSTRUCTURED MATERIALS;
SHEET METAL;
EPOXY MOLDING COMPOUNDS (EMC);
NANOWIRES;
EPOXY RESINS;
NANOWIRE;
OXIDATION;
TOUGHNESS;
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EID: 4444324166
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2004.05.018 Document Type: Article |
Times cited : (3)
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References (33)
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