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Volumn 311, Issue 1-2, 2001, Pages 217-225

Failure paths of the Cu-based leadframe/EMC joints

Author keywords

Black oxide; Copper based leadframe; Epoxy molding compound; Failure path; Fracture toughness; Phase angle

Indexed keywords

ATOMIC FORCE MICROSCOPY; AUGER ELECTRON SPECTROSCOPY; CANTILEVER BEAMS; COPPER; ENERGY DISPERSIVE SPECTROSCOPY; EPOXY RESINS; FAILURE ANALYSIS; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); JOINTS (STRUCTURAL COMPONENTS); SANDWICH STRUCTURES; SCANNING ELECTRON MICROSCOPY; SHEET MOLDING COMPOUNDS; X RAY DIFFRACTION;

EID: 0035979425     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(00)01472-6     Document Type: Article
Times cited : (9)

References (17)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.