|
Volumn 311, Issue 1-2, 2001, Pages 217-225
|
Failure paths of the Cu-based leadframe/EMC joints
|
Author keywords
Black oxide; Copper based leadframe; Epoxy molding compound; Failure path; Fracture toughness; Phase angle
|
Indexed keywords
ATOMIC FORCE MICROSCOPY;
AUGER ELECTRON SPECTROSCOPY;
CANTILEVER BEAMS;
COPPER;
ENERGY DISPERSIVE SPECTROSCOPY;
EPOXY RESINS;
FAILURE ANALYSIS;
FRACTURE TOUGHNESS;
INTERFACES (MATERIALS);
JOINTS (STRUCTURAL COMPONENTS);
SANDWICH STRUCTURES;
SCANNING ELECTRON MICROSCOPY;
SHEET MOLDING COMPOUNDS;
X RAY DIFFRACTION;
EPOXY MOLDING COMPOUNDS;
INTERFACE CRACKS;
LEADFRAME SHEETS;
COMPOSITE STRUCTURES;
FRACTURE TOUGHNESS;
JOINT;
|
EID: 0035979425
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/S0921-5093(00)01472-6 Document Type: Article |
Times cited : (9)
|
References (17)
|