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Journal of Adhesion Science and Technology

Volumn 16, Issue 5, 2002, Pages 565-578

Fracture toughness curves for epoxy molding compound/leadframe interfaces

(1) Lee, Ho Young a

a Seoul National University (South Korea)

Author keywords

Epoxy molding compound; Fracture toughness; Interface; Leadframe; Mixed mode

Indexed keywords

CANTILEVER BEAMS; COPPER; CRACKS; ELECTRONICS PACKAGING; EPOXY RESINS; INTERFACES (MATERIALS); MOLDING; OXIDATION; SANDWICH STRUCTURES; THERMAL STRESS; VAPOR PRESSURE;

EPOXY MOLDING COMPOUNDS (EMC); LEADFRAMES;

FRACTURE TOUGHNESS;

EID: 0036262948 PISSN: 01694243 EISSN: None Source Type: Journal
DOI: 10.1163/156856102760070376 Document Type: Article

Times cited : (6)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.