Microstructure, adhesion strength and failure path at a polymer/roughened metal interface

Journal of Adhesion Science and Technology

Volumn 17, Issue 2, 2003, Pages 195-215

  Lee, Ho Young ^a   Qu, Jianmin ^b  

^a Seoul National University   (South Korea)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Adhesion; Fracture; Interface; Surface roughness

Indexed keywords

CANTILEVER BEAMS; COPPER ALLOYS; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); INTERFACIAL ENERGY; MICROELECTRONICS; MICROSTRUCTURE; OXIDATION; POLYMERS; SURFACE ROUGHNESS; ADHESION; ALKALINITY; BOND STRENGTH (MATERIALS); FRACTURE; FRACTURE ENERGY; METAL MOLDING; METALS;

MECHANICAL INTERLOCKING;

ADHESION; POLYMERS;

ADHESION TEST; ALKALINE SOLUTIONS; CHEMICAL OXIDATION; COHESIVE FAILURES; COPPER-BASED; DOUBLE-CANTILEVER BEAM; EPOXY MOLDING COMPOUNDS; FAILURE PATHS; FRACTURE SURFACES; INTERFACIAL ADHESIONS; INTERFACIAL FRACTURE ENERGY; LEAD-FRAME; MECHANICAL INTERLOCKING; METAL INTERFACE; METAL SURFACES; MICROELECTRONICS PACKAGING;

EID: 0037287372     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856103762302005     Document Type: Article

References (25)

1. S. Luo, M. Vidal and C. P. Wong, in: Proc. 50th Electronic Component Technol. Conf., pp. 586-591 (2000).
2. I. Fukuzawa, S. Ishiguro and S. Nanbu, in: Proc. 23rd Intl. Reliability Physics Symp., pp. 192-197 (1985).
3. S. Omi, K. Fujita, T. Tsuda and T. Maeda, in: Proc. 41st Electronic Component Technol. Conf., pp. 766-771 (1991).
4. L. T. Nguyen, ASME Trans. J. Electron. Packag. 115, 346-335 (1993).
5. C. Lee, W. Hösler, H. Cerva, R. von Criegern and A. Parthasarathi, IEEE Trans. Adv. Packag. 22 (3), 398-406 (1999).
6. C. Lee, T. C. Wong and H. Pape, in: Proc. 46th Electronic Component Technol. Conf., pp. 78-91 (1996).
7. A. Altimari, S. Golwalkar, P. Boysan and R. Foehringer, in: Proc. 42nd Electronic Component Technol. Conf., pp. 945-950 (1992).
8. O. Yoshioka, N. Okabe, S. Nagayama, R. Yagagishi and G. Murakami, in: Proc. 39th Electronic Component Technol. Conf., pp. 464-471 (1989).
9. J. M. Park and J. P. Bell, in: Adhesion Aspects of Polymeric Coatings, K. L. Mittal (Ed.), pp. 205-224. Plenum Press, New York (1983).
10. G. Xue, G. Shi, J. Ding, W. Chang and R. Chen, J. Adhesion Sci. Technol. 4, 723-732 (1990).
11. H. Ohsuga, H. Suzuki, T. Aihara and T. Hamano, in: Proc. 44th Electronic Component Technol. Conf., pp. 141-146 (1994).
12. F. Djennas, E. Prack and Y. Matsuda, IEEE Trans. CHMT 16, 919-924 (1993).
13. G. S. Ganesan, G. L. Lewis, T. Anderson and H. M. Berg, in: Proc. 46th Electronic Component Technol. Conf., pp. 68-70 (1996).
14. H. K. Yun, K. Cho, J. H. An and C. E. Park, J. Mater. Sci. 27, 5811-5817 (1992).
15. J. R. G. Evans and D. E. Packham, J. Adhesion 9, 267-277 (1978).
16. V. Ashworth and D. Fairhurst, J. Electrochem. Soc. 124, 506-517 (1977).
17. H.-H. Strehblow and B. Titze, Electrochim. Acta 55, 839-850 (1980).
18. J. W. Hutchinson and Z. Suo, in: Advances in Applied Mechanics, J. W. Hutchinson and T. Y. Wu (Eds), Vol. 29, pp. 63-191. Academic Press, New York (1991).
19. Z. Suo and J. W. Hutchinson, Mater. Sci. Eng. A107, 135-143 (1989).
20. T. S. Oh, R. M. Cannon and R. O. Ritchie, J. Am. Ceram. Soc. 70, C-352-C-355 (1987).
21. H. Y. Lee and J. Yu, Mater. Sci. Eng. A277, 154-159 (2000).
22. A. Kelly and G. J. Davies, Metall. Rev. 10, 1-77 (1965).
23. K. K. Chawla, in: Composite Materials, p. 387. Springer-Verlag, New York (1998).
24. R. S. Krishnan, R. Srinivasan and S. Devanarayanan, in: Thermal Expansion of Crystals, p. 176. Pergamon Press, New York (1979).
25. H. Y. Lee and J. Yu, J. Electron. Mater. 28, 1444-1447 (1999).