Estimation of warpage and thermal stress of IVHs in flip-chip ball grid arrays package by FEM

Microelectronics Reliability

Volumn 48, Issue 2, 2008, Pages 300-309

  Cho, Seunghyun ^a   Cho, Soonjin ^a   Lee, Joseph Y ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; SUBSTRATES; THERMAL STRESS;

INNER VIA HOLE (IVH); SUBSTRATE WARPAGE; THERMAL DEFORMATION;

CHIP SCALE PACKAGES;

EID: 44249104723     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.06.001     Document Type: Article

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