Numerical simulation of interfacial delamination in electronic packaging

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 400-404

  Wang, B ^a   Sun, X ^a   Fan, Q S ^a   Yin, Y ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY ELEMENT METHOD; COMPUTER SIMULATION; CRACK PROPAGATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE MECHANICS; GALERKIN METHODS; INTERFACES (MATERIALS); SEMICONDUCTING SILICON; THERMAL EFFECTS; THERMAL EXPANSION; THERMAL STRESS;

COEFFICIENT OF THERMAL EXPANSIONS; INTERFACIAL FRACTURE MECHANICS; SILICON CHIP;

ELECTRONICS PACKAGING;

EID: 0033710315     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)