Thermal deformations and stresses of flip-chip BGA packages with low- and high-Tg underfills

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 4, 2005, Pages 328-337

  Tsai, Ming Yi ^a   Lin, Yi Chieh ^a   Huang, Chen Yu ^a   Wu, Jenq Dah ^b  

^a CHANG GUNG UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Fillet; Flip chip package; Glass transition temperature; Solder reflow; Stress relaxation; Suhir's solution; Thermal stress; Underfill; Warpage

Indexed keywords

DEFORMATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; GLASS TRANSITION; STRESS RELAXATION; TEMPERATURE; THERMAL STRESS;

BALL GRID ARRAY (BGA); FLIP CHIP PACKAGE; HIGH UNDERFILL; LOW UNDERFILL; SOLDER REFLOW; SUHIR SOLUTION;

CHIP SCALE PACKAGES;

EID: 27844544332     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.856536     Document Type: Article

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