High-performance FCBGA based on multi-layer thin-substrate packaging technology

Microelectronics Reliability

Volumn 44, Issue 3, 2004, Pages 515-520

  Shimoto, Tadanori ^a   Kikuchi, Katsumi ^a   Baba, Kazuhiro ^a   Matsui, Koji ^a   Honda, Hirokazu ^b   Kata, Keiichiro ^b  

^a NEC CORPORATION   (Japan)

^b RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; COST EFFECTIVENESS; FLIP CHIP DEVICES; GLASS TRANSITION; LSI CIRCUITS; MOUNTINGS;

FLIP-CHIP BALL GRID ARRAY (FCBGA); PACKAGING TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 1142276063     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00164-1     Document Type: Article

References (5)

1. International Technology Roadmap for Semiconductors 2002 Edition, SIA, 2002.
2. Tummala R. Microelectronic systems packaging technology for the 21st century. Adv. Microelectron. 26(3):1999;29-37.
3. Enomoto R, Asai M, Hirose N. High density MLB using additive and build-up process. In: Proceedings of the 1998 IMAPS. p. 403-8.
4. Shimoto T., Matsui K., Kikuchi K., Shimada Y., Utsumi K. New high-density multilayer technology on PCB. IEEE Trans. Comp., Packag., Manufact., Technol. Advanced Packaging. 22(2):1999.
5. Kikuchi K, Shimoto T, Honda H, Kata K, Matsui K, Morishige S. High-density multi-layer thin-film packaging technology for high-performance ASIC chips. In: Proceedings of the 2001 IMAPS. p. 242-7.