SCOPUS 정보 검색 플랫폼

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 931-938

Creep behavior of a molding compound and its effect on packaging process stresses

(4) Kiasat, M S a Zhang, G Q a Ernst, L J a Wisse, G a

a DELFT UNIVERSITY OF TECHNOLOGY (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; COST EFFECTIVENESS; CRACK INITIATION; CREEP TESTING; EPOXY RESINS; POISSON RATIO; PROCESS ENGINEERING; PRODUCT DESIGN; SHEET MOLDING COMPOUNDS; THERMAL EXPANSION; THERMAL STRESS;

COST SAVING; EPOXY MOLDING; PACKAGE DESIGN; PACKAGING PROCESS STRESSES;

ELECTRONICS PACKAGING;

EID: 0034829264 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (13)

References (9)

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2
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3
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5
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6
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7
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- Shrinkage and stress build-up in unsaturated polyester resin during curing
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8
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- Ph.D. thesis, Delft University of Technology, Delft, The Netherlands
- (2000)
- Kiasat, M.S.¹

9
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- Determination of visco-elastic properties during the curing process of underfill materials
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- Ernst, L.J.¹ Van't Hof, C.² Zhang, G.Q.³ Yang, D.G.⁴ Kiasat, M.S.⁵ Bressers, H.J.L.⁶ Caers, J.F.J.⁷ Janssen, J.⁸

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.