Experimental investigations on particle contamination of masks without protective pellicles during vibration or shipping of mask carriers

IEEE Transactions on Semiconductor Manufacturing

Volumn 20, Issue 4, 2007, Pages 578-584

  Yook, Se Jin ^a   Fissan, Heinz ^b   Asbach, Christof ^b   Kim, Jung Hyeun ^c   Dutcher, Dabrina D ^a   Yan, Pei Yang ^a   Pui, David Y H ^d  

^a University of Minnesota   (United States)

^b Institute of Energy and Environmental Technology   (Germany)

^c University of Seoul   (South Korea)

^d INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT POINTS; CRITICAL SURFACES; EXPERIMENTAL INVESTIGATIONS; EXTREME ULTRA-VIOLET LITHOGRAPHIES; MASK BLANKS; NEXT GENERATION LITHOGRAPHIES; OFFLINE; PARTICLE CONTAMINATIONS; PARTICLE DETECTIONS; PARTICLE GENERATIONS; REDUCING PARTICLES; SOLID MATERIALS;

COMPUTER CONTROL SYSTEMS; OXIDE MINERALS; PHOTOMASKS; QUARTZ; ULTRAVIOLET DEVICES;

EXTREME ULTRAVIOLET LITHOGRAPHY;

EID: 43849110798     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2007.907635     Document Type: Article

References (23)

1. E. M. Gullikson, E. Tejnil, T. Liang, and A. R. Stivers, "EUVL defect printability at the 32-nm node," in Proc. SPIE, May 2004, vol. 5374, pp. 791-796.
2. K. Hamamoto, Y. Tanaka, S. Y. Lee, N. Hosokawa, N. Sakaya, M. Hosoya, T. Shoki, T. Watanabe, and H. Kinoshita, "Mask defect inspection using an extreme ultraviolet microscope," J. Vac. Sci. Technol. B, vol. 23, pp. 2852-2855, Nov./Dec. 2005.
3. P. Y. Yan, L. He, A. Ma, and K. Orvek, "Clean mask shipping module development and demonstration for EUVL masks and blanks," in Proc. SPIE, 2006, p. 62830.
4. K. Diefendorff, Extreme Lithography: Intel backs EUV for next-generation lithography Jun. 19, 2000 [Online]. Available: ftp://download. intel.com/technology/silicon/diefendorff-reprint.pdf, Microprocessor Report [Online] Available
5. S. Hector and P. Mangat, "Review of progress in extreme ultraviolet lithography masks," J. Vac. Sci. Technol. B, vol. 19, pp. 2612-2616, Nov./Dec. 2001.
6. L. C. Litt, S. Hector, and P. Seidel, "EUV lithography without pellicles: Working without a net," Future Fab Int., Jul. 11, 2003 [Online]. Available: http://www.future-fab.com/documents.asp?d-ID=1898, [Online]. Available:
7. C. Asbach, H. Fissan, J. H. Kim, S. J. Yook, and D. Y. H. Pui, "Technical Note: Concepts for protection of EUVL masks from particle contamination," J. Nanop. Res., vol. 8, pp. 705-708, Oct. 2006.
8. J. H. Kim, C. Asbach, S. J. Yook, H. Fissan, K. J. Orvek, A. Ramamoorthy, P. Y. Yan, and D. Y. H. Pui, "Protection schemes for critical surface in vacuum environments," J. Vac. Sci. Technol. A, vol. 23, pp. 1319-1324, Sep./Oct. 2005.
9. C. Asbach, D. Y. H. Pui, J. H. Kim, S. J. Yook, and H. Fissan, "Modeling of protection schemes for critical surfaces under low pressure conditions: Comparison between analytical and numerical approach," J. Vac. Sci. Technol. B, vol. 23, pp. 2419-2426, Nov./Dec. 2005.
10. J. H. Kim, H. Fissan, C. Asbach, S. J. Yook, D. Y. H. Pui, and K. J. Orvek, "Investigation of thermophoretic protection with speed-controlled particles at 100, 50, and 25 mTorr," J. Vac. Sci. Technol. B., vol. 24, pp. 1178-1184, May/Jun. 2006.
11. S. J. Yook, H. Fissan, C. Asbach, J. H. Kim, J. Wang, P. Y. Yan, and D. Y. H. Pui, "Evaluation of protection schemes for extreme ultraviolet lithography (EUVL) masks against top-down aerosol flow," J. Aerosol Sci., vol. 38, pp. 211-227, Feb. 2007.
12. S. J. Yook, H. Fissan, C. Asbach, J. H. Kim, T. van der Zwaag, T. Engelke, P. Y. Yan, and D. Y. H. Pui, "Experimental investigations of protection schemes for extreme ultraviolet lithography (EUVL) masks in carrier systems against horizontal aerosol flow," IEEE Trans. Semicond. Manuf., vol. 20, pp. 176-186, May 2007.
13. E. Tejnil, E. Gullikson, and A. Stivers, "Characterization of defect detection sensitivity in inspection of mask substrates and blanks for extreme ultraviolet lithography," in Proc. SPIE, 2004, vol. 5567, pp. 943-952.
14. quot;Specification for extreme ultraviolet lithography mask substrates," SEMI P37-1102 2002, SEMI 2001.
15. R. Knollenberg, "A polarization diversity two-color surface analysis system," J. Environ. Sci., vol. 30, pp. 30-38, 1987.
16. E. Gard, J. E. Mayer, B.D.Morrical, T. Dienes, D. P. Fergenson, and K. A. Prather, "Real-time analysis of individual atmospheric aerosol particles: Design and performance of a portable ATOFMS," Anal. Chem., vol. 69, pp. 4083-4091, Oct. 1997.
17. Y. Su, M. F. Sipin, H. Furutani, and K. A. Prather, "Development and characterization of an aerosol time-of-flight mass spectrometer with increased detection efficiency," Anal. Chem., vol. 76, pp. 712-719, Feb. 2004.
18. E. de Hoffmann and V. Stroobant, Mass Spectrometry: Principles and Applications, 2nd ed. New York: Wiley, 2001.
19. quot;ISTA Procedure 1G: Packaged-products 150 lb (68 kg) or less (random vibration). International Safe," [Online]. Available: http://www.ista.org/ Testing/ProcOverviews/1Goverview.pdf Transit Association. 2001.
20. W. I. Kipp, "Vibration testing equivalence: How many hours of testing equals how many miles of transport?," in ISTA Con 2000, Apr. 26, 2000 [Online]. Available: http://www.ista.org/Knowledge/Vibration-Testing- Equivalence-Kipp-2000.pdf, unpublished
21. M. V. Johnston, "Sampling and analysis of individual particles by aerosol mass spectrometry," J. Mass. Spectrom., vol. 35, pp. 585-595, May 2000.
22. J. F. Archard, "Contact and rubbing of flat surfaces," J. Appl. Phys., vol. 24, pp. 981-988, Aug. 1953.
23. J. F. Molinari, M. Ortiz, R. Radovitzky, and E. A. Repetto, "Finitieelement modeling of dry sliding wear in metals," Eng. Computations, vol. 18, pp. 592-609, 2001.