Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder

Materials Transactions

Volumn 49, Issue 3, 2008, Pages 443-448

  Nogita, K ^a   Gourlay, C M ^a   Read, J ^a   Nishimura, T ^b   Suenaga, S ^b   Dahle, A K ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

^b School of Materials Engineering   (Japan)

Author keywords

Eutectic; Lead free soldering; Nickel; Phosphorus; Solidification

Indexed keywords

FLUIDITY; INTERMETALLICS; MICROSTRUCTURE; SOLDERING; SOLIDIFICATION; TIN COMPOUNDS; VOLUME FRACTION;

ANTI-OXIDATION AGENT; LEAD-FREE SOLDERING;

PHOSPHORUS;

EID: 42349113410     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MBW200713     Document Type: Article

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