Low-temperature wafer bonding optimal O2 plasma surface pretreatment time

Electrochemical and Solid-State Letters

Volumn 7, Issue 8, 2004, Pages

  Zhang, Xuanxiong ^a   Raskin, Jean Pierre ^a  

^a UNIVERSITÉ CATHOLIQUE DE LOUVAIN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL BONDS; INTERFACES (MATERIALS); MICROELECTROMECHANICAL DEVICES; OXYGEN; PARAMETER ESTIMATION;

BONDING STRENGTH; EXPOSURE TIME; PLASMA SURFACES; WAFER BONDING;

PLASMAS;

EID: 4344686866     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1763793     Document Type: Article

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