Dynamic simulation and optimization of Cu CVD unit process for environmentally benign manufacturing

IEEE Transactions on Semiconductor Manufacturing

Volumn 17, Issue 3, 2004, Pages 455-469

  Cho, Soon ^a   Lei, Wei ^a   Melvin, Adam ^b   Rubloff, Gary W ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b UNIVERSITY OF ARIZONA   (United States)

Author keywords

Cu chemical vapor deposition (CVD); Design for environment; Dynamic simulation; Environment safety health

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COMPETITION; COMPUTER SIMULATION; COPPER; COSTS; HEALTH CARE; INTEGRATED CIRCUITS; OPTIMIZATION; PARAMETER ESTIMATION;

COOPTIMIZATION; CU CHEMICAL VAPOR DEPOSITION (CVD); DESIGN FOR ENVIRONMENT; ENVIRONMENT SAFETY HEALTH;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 4344645692     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2004.831942     Document Type: Conference Paper

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