Magnetically enhanced inductively coupled plasma etching of 6H-SiC

IEEE Transactions on Plasma Science

Volumn 32, Issue 3 II, 2004, Pages 1362-1366

  Kim, D W ^a   Lee, H Y ^a   Kyoung, S J ^a   Kim, H S ^a   Sung, Y J ^b   Chae, S H ^b   Yeom, G Y ^a  

^a Sungkyunkwan University   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; EMISSION SPECTROSCOPY; NICKEL; OXYGEN; PLASMA ETCHING; PLASMA PROBES; SILICON CARBIDE; SILICON WAFERS; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER MASK LAYER; LANGMUIR PROBE; MAGNETICALLY ENHANCED INDUCTIVELY COUPLED PLASMAS; OPTICAL EMISSION SPECTROSCOPY;

INDUCTIVELY COUPLED PLASMA;

EID: 4344560475     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2004.828821     Document Type: Article

References (15)

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