Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 89-93

  Jurenka, Claudia ^a   Kim, Jon Yeon ^b   Wolf, M Jürgen ^a   Engelmann, Gunter ^a   Ehrmann, Oswin ^a   Yu, Jin ^b   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ELECTRODEPOSITION; LEAD; LITHOGRAPHY; MASKS; NICKEL; TIN;

INTERMETALLIC PHASE; LEAD FREE BUMPING; LITHOGRAPHIC MASK;

COPPER;

EID: 24644443368     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Tummala R., Fundamentals of Microsystems Packaging (McGraw Hill, New York, 2000), Chap. 9
2. Wolf J. M. et al, Micromaterials and Nanomaterials, No. 3, 2004, pp 234-244
3. Li M. et al, J. Mater. Res, Vol.17, No. 7, Jul. 2002, pp. 1612
4. Dietrich L. et al, Third Internat. Symposium on Electronic Packaging Technology (ISEPT'98), Beijing (China), Aug. 17-20, 1998
5. Kattner U. R. et al, Z. Metallkd. Vol. 92, No. 7, Jul. 2001, pp 740-746