Dilute Cu alloying for Sn-Cu bumping by annealing electroplated Cu/Sn stacks on Ti/Ni/Pd UBM

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 550-555

  Ezawa, Hirokazu ^a   Higuchi, Kazuhito ^a   Seto, Masaharu ^a   Uchida, Masayuki ^a   Togasaki, Takashi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; ANNEALING; ELECTROPLATED PRODUCTS; INTERMETALLICS; THICKNESS MEASUREMENT; TIN ALLOYS;

BUMPING; EUTECTIC COMPOSITION;

COPPER;

EID: 42549096937     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280057     Document Type: Conference Paper

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