Pb-free bumping by alloying electroplated metal stacks

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 664-667

  Ezawa, Hirokazu ^a   Miyata, Masahiro ^a   Seto, Masaharu ^a   Honma, Soichi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; COMPOSITION; COPPER; DIFFERENTIAL SCANNING CALORIMETRY; ELECTROPLATING; EUTECTICS; MELTING; SILVER; SOLDERING ALLOYS; TEMPERATURE; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

ALLOYING ELECTROPLATED METAL STACKS; LEAD FREE BUMPING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0038350779     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. S-Y.Jang, J. Wolf, and K.-W. Paik, "Under Bump Metallurgy Study for Pb-free Bumping", J. Electron. Mater. Vol.31, No.5(2002), pp. 478-487.
2. H. Ezawa, M. Miyata, S. Honma, H. Inoue, T. Tokuoka, J. Yoshioka, and M. Tsujimura, "Eutectic Sn-Ag Solder Bump Process for ULSI Flip Chip Technology", IEEE Trans. Electronics Packaging Manufacturing, Vol. 24, No.4 (2001),pp.275-281.