Pb-free bumping for high-performance SoCs

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 655-660

  Ezawa, Hirokazu ^a   Seto, Msaharu ^a   Katsumata, Hiroshi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTALLOGRAPHY; DIFFERENTIAL SCANNING CALORIMETRY; GAS CHROMATOGRAPHY; INTERMETALLICS; MASS SPECTROMETRY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; TEXTURES; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

BUMPING; COALESCING; ELECTRON BACKSCATTER DIFFRACTION (EBSD); SYSTEM-ON-CHIPS (SOC);

LEAD;

EID: 10444227243     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. H. Ezawa, M. Miyata, S. Honma, H. Inoue, T. Tokuoka, J. Yoshioka, and M. Tsujimura, "Eutectic Sn-Ag Solder Bump Process for ULSI Flip Chip Technology", IEEE Trans.Elecronics Packaging Manufacturing, Vol. 24 ,No.4 (2001),pp.275-281.
2. rd Electronic Components & Technology Conference, 2003, pp.664-667.
3. K. N. Tu, "Recent advances on electromigration in very-large-scale-integration of interconnects", J. Appl. Phys. Vol.94, No.9(2003),pp.5451-5473.
4. S-Y.Jang, J. Wolf, and K.-W. Paik, "Under Bump Metallurgy Study for Pb-free Bumping", J. Electron. Mater.Vol.31, No.5(2002), pp. 478-487.