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Volumn 6669, Issue , 2007, Pages

Is the thermal resistance coefficient of high-power LEDs constant?

Author keywords

Junction temperature; LED; Life; Light emitting diode; Thermal resistance coefficient

Indexed keywords

ELECTRIC CONDUCTIVITY; ENERGY DISSIPATION; HEAT RESISTANCE; TEMPERATURE DISTRIBUTION;

EID: 42149184043     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.738739     Document Type: Conference Paper
Times cited : (33)

References (13)
  • 3
    • 33746383276 scopus 로고    scopus 로고
    • Variation of thermal resistance with input power in LEDs
    • physica status solidic
    • L. Yang, J. Hu, L. Kim, and M. W. Shin, "Variation of thermal resistance with input power in LEDs," physica status solidi(c) 3, 2187-2190 (2006).
    • (2006) , vol.3 , pp. 2187-2190
    • Yang, L.1    Hu, J.2    Kim, L.3    Shin, M.W.4
  • 4
    • 38549136951 scopus 로고    scopus 로고
    • Investigation of thermal measurement variables in high power GaN-based LEDs
    • L. Yang, J. Hu, and M.W. Shin, "Investigation of thermal measurement variables in high power GaN-based LEDs," Solid State Phenomena 124-126, 483-486 (2007).
    • (2007) Solid State Phenomena , vol.124-126 , pp. 483-486
    • Yang, L.1    Hu, J.2    Shin, M.W.3
  • 6
    • 0347410916 scopus 로고    scopus 로고
    • Measurement of junction temperature confirms package thermal design
    • B. Siegal, "Measurement of junction temperature confirms package thermal design" Laser Focus World 39(11), S12-S14 (2003).
    • (2003) Laser Focus World , vol.39 , Issue.11
    • Siegal, B.1
  • 10
    • 0023862363 scopus 로고
    • Factors affecting semiconductor device thermal resistance measurements Semiconductor Thermal and Temperature Measurement Symposium, SEMI-THERM IV
    • B.S. Siegal, "Factors affecting semiconductor device thermal resistance measurements" Semiconductor Thermal and Temperature Measurement Symposium, SEMI-THERM IV., Fourth Annual IEEE, 12-18 (1988).
    • (1988) Fourth Annual IEEE , pp. 12-18
    • Siegal, B.S.1
  • 12
    • 31844436685 scopus 로고    scopus 로고
    • Thermal design considerations in the packaging of GaN based light emitting diodes Fifth International Conference on Solid State Lighting
    • A. Christensen, D. Nicol, I. Ferguson, S. Graham, "Thermal design considerations in the packaging of GaN based light emitting diodes" Fifth International Conference on Solid State Lighting, Proceedings of SPIE 5941, 594118 (2006).
    • (2006) Proceedings of SPIE , vol.5941 , pp. 594118
    • Christensen, A.1    Nicol, D.2    Ferguson, I.3    Graham, S.4
  • 13
    • 42149090080 scopus 로고    scopus 로고
    • Y. Zhang, A. Xiao, and J. McVey, Advanced thermal interface materials Advanced Electronic Packaging, eds. V.P. Atluri, S. Sharan, C-P Wong, and D. Frear, Materials Research Society Symposium, Proceedings 968, 0968-V05-10 (2007).
    • Y. Zhang, A. Xiao, and J. McVey, "Advanced thermal interface materials" Advanced Electronic Packaging, eds. V.P. Atluri, S. Sharan, C-P Wong, and D. Frear, Materials Research Society Symposium, Proceedings 968, 0968-V05-10 (2007).


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.