Variation of thermal resistance with input power in LEDs

Physica Status Solidi (C) Current Topics in Solid State Physics

Volumn 3, Issue , 2006, Pages 2187-2190

  Yang, Lianqiao ^a   Hu, Jianzheng ^a   Kim, Lan ^a   Shin, Moo Whan ^a  

^a Myong Ji University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

POWER DISSIPATION; THERMAL BEHAVIOR; TRANSIENT THERMAL MEASUREMENT; 44.10.+I; 85.60.BT; 85.60.JB; ELECTRICAL RESISTANCES; HIGH POWER LIGHT EMITTING DIODES; STRUCTURE FUNCTIONS; THERMAL BEHAVIORS;

ELECTRIC CURRENTS; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; HEAT RESISTANCE; MATHEMATICAL MODELS; THERMOANALYSIS;

LIGHT EMITTING DIODES;

EID: 33746383276     PISSN: 18626351     EISSN: None     Source Type: Journal    
DOI: 10.1002/pssc.200565169     Document Type: Conference Paper

References (7)

1. B. S. Siegal, Electronics 51, 121-126 (1978).
2. G. Farkas, Q. van Voorst Vader, A. Poppe, and G. Bognar, Proc. of 9th THERMNIC Workshop, Sept. 24-26, 2003, pp. 213-218.
3. A. Keffous, M. Siad, S. Mamma, Y. Belkacem, C. Lakhar Chaouch, H. Menari, A. Dahmani, and W. Chergui, Appl. Surf. Sci. 218, 337-343 (2003).
4. S. W. Chung, W. J. Hwang, Chin C. Lee, and M. W. Shin, J. Cryst. Growth 268, 607-611 (2004).
5. Moo Whan Shin, Proc. of International LED Seminar 2005, Koyang, Korea, May 26-27, 2005, pp. 49-77.
6. Hyunsoo Kim, Seong-Ju Park, and Hyunsang Hwang, IEEE Trans. Electron. Devices 49(10), 1715-1722 (2002).
7. X. Guo and E. F. Schubert, Appl. Phys. Lett. 78(21), 3337-3339 (2001).