Measurement of junction temperature confirms package thermal design

Laser Focus World

Volumn 39, Issue 11, 2003, Pages

  Siegal, Bernie ^a  

^a Thermal Engineering Associates Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; ELECTRIC CURRENT MEASUREMENT; HEAT RESISTANCE; LIGHT EMITTING DIODES; OPTICAL TESTING; SEMICONDUCTOR JUNCTIONS; SEMICONDUCTOR LASERS; TEMPERATURE MEASUREMENT; VOLTAGE MEASUREMENT;

ELECTRICAL TEST METHOD; JUNCTION TEMPERATURE; THERMAL DESIGN;

ELECTRONICS PACKAGING;

EID: 0347410916     PISSN: 10438092     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (7)

1. Product Catalog, Melles Griot, (2002), pp. 45.2-45.3
2. Product Catalog, Melles Griot, (2002), pp. 45.2-45.3
3. Mil-Std 750, Method 3101, U.S. Dept. of Defense.
4. J. J. Hughes, D. B. Gilbert, and F. Z. Hewrylo, RCA Review 46, 200 (June 1985).
5. B. Siegal, Electro-Optical systems Design, Kiver Publications, 47 (November 1981).
6. JESD51-1, EIA JEDEC,.
7. B. Siegal, Proc. PhoPack 2002, (July 2002).