Solder joint fatigue life of fine pitch BGAs - Impact of design and material choices

Microelectronics Reliability

Volumn 40, Issue 7, 2000, Pages 1117-1127

  Darveaux, Robert ^a   Heckman, Jim ^a   Syed, Ahmer ^a   Mawer, Andrew ^b  

^a AMKOR TECHNOLOGY   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; FATIGUE OF MATERIALS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; SOLDERED JOINTS; STIFFNESS; SUBSTRATES; THERMAL EXPANSION;

BALL GRID ARRAYS (BGA);

ELECTRONICS PACKAGING;

EID: 0034224822     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00038-X     Document Type: Article

References (16)

1. Darveaux R, Heckman J, Mawer A. Effect of test board design on the 2nd level reliability of a fine pitch BGA package. Proc SMI 1998. p. 105-11.
2. Miles B, Fusaro J, Panczak T, Darveaux R. Fine pitch BGA package assembly. Proc SMI 1998. p. 29-33.
3. Syed A, Panczak T, Darveaux R, Lee SG, Lee CH, Partridge J. Solder joint reliability of chip array BGA™. Proc SMTA 1999. p. 90-7.
4. Fjelstad J, DiStefano T, Perry M. Compliancy modeling of an area array chip scale package. Proc SMI 1996. p. 236-43.
5. Ejim T, Holliday A, Bader FE, Gahr S. Designed experiment to determine attachment reliability drivers for PBGA packages. Proc SMI 1995. p. 385-92.
6. El-Gore MK, Peterson M, Pavuluri K, Settles J, Hundt P, Berry J, Takeda H. Evaluation of 64 pin micro star EGA™ package. Proc 1999 Pan Pacific Microelectronics Symposium. p. 98-105.
7. Sato T, Tanaka K, Sumikawa M, Yoshioka C, Yamamura K, Nukii T. Reliability and fatigue life prediction of mounted CSP. Proc 1998 ISHM International Symposium on Microelectronics, p. 531-6.
8. Schueller RD, Geissinger J. New chip scale package with CTE matching to the board. Proc IRE6 1st Electronics Packaging Technology Conference, EPTC, 1997. p. 219-27.
9. Schueller RD, Harrey P, Heidick R, Kinningham A. Electrical performance and reliability of TBGA with grounded stiffener. Proc SMI 1997. p. 16-27.
10. Atterwalla AI, Stierman R. Failure mode analysis of a 540 pin plastic ball grid array. Proc SMI 1994. p. 252-7.
11. Masumoto K. Development of fine-pitch micro star BGATM. Proc Semicon West 1997.
12. Juso H, Yamaji Y, Kimura T, Fujita K, Kada M. Board level reliability of CSP. Proc ECTC 1998. p. 525-31.
13. Darveaux R, Mawer A. Thermal and power cycling limits of plastic ball grid array (PBGA) assemblies. Proc SMI 1995. p. 315-26.
14. Darveaux R. Optimizing the reliability of thin small outline package (TSOP) solder joints. Advances in Electronic Packaging 1995 - Proc ASME Interpack '95. p. 675-85.
15. Mawer A, Cho D, Darveaux R. The effect of PBGA solder pad geometry on solder joint reliability. Proc SMI 1996. p. 127-35.
16. Mawer A, Simmons K, Burnett T, Oyler B. Assembly and interconnect reliability of BGA assembled on to blind micro and through-hole drilled via in pad. Proc SMI 1998. p. 21-8.