Evaluation of reliability of μBGA solder joints through twisting and bending

Microelectronics Reliability

Volumn 39, Issue 3, 1999, Pages 391-399

  Perera, U Daya ^a  

^a University of Oulu   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); FAILURE ANALYSIS; PRINTED CIRCUIT BOARDS; RELIABILITY; WEIBULL DISTRIBUTION;

MICROBALL GRID ARRAY; MICROLAND GRID ARRAY;

SOLDERED JOINTS;

EID: 0032629132     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(98)00212-1     Document Type: Article

References (7)

1. Perera UD. Evaluation of reliability of μBGA solder joint through twisting and bending. In: Proceeding of the International Symposium on Microelectronics, Philadelphia, 1997. 14. p. 402-407.
2. Lau JH. Ball grid array (BGA) technology, McGraw-Hill, New York, 1994.
3. Lau JH, Pao YH. Solder joint reliability of BGA, CSP, flip chip and fine pitch SMT assemblies, McGraw Hill, New York, 1997.
4. Engelmaier W. BGA and CGA solder attachments: results of low-acceleration reliability tests and analysis. In: Proceedings of the Surface Mount International Conference on Advance Electronics Manufacturing Technologies. Sam Jose, CA, USA, 1995. 29. p. 244-358.
5. Lau J.H., et al. Solder joint reliability of large plastic ball grid array assemblies under bending, twisting and vibration conditions. Circuit World. 22:1995;27-32.
6. Knadle KT et al. Verifying A TBGA card assembly process using innovative reliability tests and DOE. In: Proceedings of SMI Conference, 1995. August. p. 402-410.
7. O'Conner PDT. Practical Reliability Engineering. Second ed., Wiley-Interscience, New York, 1985.