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Volumn 16, Issue 4, 2008, Pages 432-443

Adaptive cooling of integrated circuits using digital microfluidics

Author keywords

Adaptive cooling; Chip cooling; Digital micro fluidics; Electrowetting; Hot spot cooling; Microfluidics

Indexed keywords

COOLING; MICROFLUIDICS; PRODUCT DESIGN; TEMPERATURE CONTROL;

EID: 41549154335     PISSN: 10638210     EISSN: None     Source Type: Journal    
DOI: 10.1109/TVLSI.2007.915434     Document Type: Article
Times cited : (93)

References (33)
  • 1
    • 33847360659 scopus 로고    scopus 로고
    • Autonomously- triggered microfluidic cooling using thermo-responsive hydrogels
    • A. K. Agarwal, L. Dong, D. J. Beebe, and H. Jiang, "Autonomously- triggered microfluidic cooling using thermo-responsive hydrogels," Lab on a Chip, vol. 7, pp. 310-315, 2007.
    • (2007) Lab on a Chip , vol.7 , pp. 310-315
    • Agarwal, A.K.1    Dong, L.2    Beebe, D.J.3    Jiang, H.4
  • 3
    • 0037301514 scopus 로고    scopus 로고
    • Creating, transporting, cutting, and merging liquid droplets by electrowetting-based actuation for digital microfluidic circuits
    • Feb
    • S. K. Cho, H. Moon, and C. J. Kim., "Creating, transporting, cutting, and merging liquid droplets by electrowetting-based actuation for digital microfluidic circuits," J. Microelectromech. Syst., vol. 12, no. 1, pp. 70-80, Feb. 2003.
    • (2003) J. Microelectromech. Syst , vol.12 , Issue.1 , pp. 70-80
    • Cho, S.K.1    Moon, H.2    Kim, C.J.3
  • 5
    • 0037531650 scopus 로고    scopus 로고
    • Thermocapillary actuation of liquid flow on chemically patterned surfaces
    • A. A. Darhuber, J. M. Davis, S. M. Troian, and W. W. Reisner, "Thermocapillary actuation of liquid flow on chemically patterned surfaces," Phys. Fluids, vol. 15, p. 1295, 2003.
    • (2003) Phys. Fluids , vol.15 , pp. 1295
    • Darhuber, A.A.1    Davis, J.M.2    Troian, S.M.3    Reisner, W.W.4
  • 7
    • 0000084072 scopus 로고    scopus 로고
    • Heat transfer enhancement using flow-induced vibration of a microfin array
    • J. S. Go, S. J. Kim, G. Lim, H. Yun, J. Lee, I. Song, and Y. E. Pak, "Heat transfer enhancement using flow-induced vibration of a microfin array," Sensors Actuators A, vol. 90, pp. 232-239, 2001.
    • (2001) Sensors Actuators A , vol.90 , pp. 232-239
    • Go, J.S.1    Kim, S.J.2    Lim, G.3    Yun, H.4    Lee, J.5    Song, I.6    Pak, Y.E.7
  • 8
    • 26844547080 scopus 로고    scopus 로고
    • Two-dimensional digital microfluidic system by multi-layer printed circuit board
    • J. Gong and C. J. Kim, "Two-dimensional digital microfluidic system by multi-layer printed circuit board," in Proc. IEEE MEMS, 2005, pp. 726-729.
    • (2005) Proc. IEEE MEMS , pp. 726-729
    • Gong, J.1    Kim, C.J.2
  • 12
    • 0038819124 scopus 로고    scopus 로고
    • Smart pumpless loop for micro-channel electronic cooling using flat and enhanced surfaces
    • Mar
    • S. Mukherjee and I. Mudawar, "Smart pumpless loop for micro-channel electronic cooling using flat and enhanced surfaces," IEEE Trans. Compon. Packag. Technol., vol. 26, no. 1, pp. 99-109, Mar. 2003.
    • (2003) IEEE Trans. Compon. Packag. Technol , vol.26 , Issue.1 , pp. 99-109
    • Mukherjee, S.1    Mudawar, I.2
  • 13
    • 1242301079 scopus 로고    scopus 로고
    • Rapid droplet mixers for digital microfluidic systems
    • P. Paik, V. K. Pamula, and R. B. Fair, "Rapid droplet mixers for digital microfluidic systems," Lab on a Chip, vol. 3, pp. 253-259, 2003.
    • (2003) Lab on a Chip , vol.3 , pp. 253-259
    • Paik, P.1    Pamula, V.K.2    Fair, R.B.3
  • 14
  • 17
    • 0003219711 scopus 로고    scopus 로고
    • Vapor compression cooling for high performance applications
    • J. Peeples, "Vapor compression cooling for high performance applications," Electron. Cool., vol. 7, no. 3, pp. 16-24, 2001.
    • (2001) Electron. Cool , vol.7 , Issue.3 , pp. 16-24
    • Peeples, J.1
  • 19
    • 0001047405 scopus 로고    scopus 로고
    • Electrowetting- based actuation of liquid droplets for microfluidic applications
    • M. G. Pollack, R. B. Fair, and A. D. Shenderov, "Electrowetting- based actuation of liquid droplets for microfluidic applications," Appl. Phys. Lett., vol. 77, pp. 1725-1726, 2000.
    • (2000) Appl. Phys. Lett , vol.77 , pp. 1725-1726
    • Pollack, M.G.1    Fair, R.B.2    Shenderov, A.D.3
  • 20
    • 0012637388 scopus 로고    scopus 로고
    • Electrowetting- based actuation of liquid droplets for microfluidic applications
    • M. G. Pollack, A. D. Shenderov, and R. B. Fair, "Electrowetting- based actuation of liquid droplets for microfluidic applications," Lab on a Chip, vol. 2, pp. 96-101, 2002.
    • (2002) Lab on a Chip , vol.2 , pp. 96-101
    • Pollack, M.G.1    Shenderov, A.D.2    Fair, R.B.3
  • 22
    • 0033082343 scopus 로고    scopus 로고
    • Thermocapillary pumping of discrete drops in microfabricated analysis devices
    • T. Sanmarco and M. A. Burns, "Thermocapillary pumping of discrete drops in microfabricated analysis devices," Amer. Inst. Chem. Eng., vol. 45, no. 2, pp. 350-366, 1999.
    • (1999) Amer. Inst. Chem. Eng , vol.45 , Issue.2 , pp. 350-366
    • Sanmarco, T.1    Burns, M.A.2
  • 23
    • 32844463783 scopus 로고    scopus 로고
    • Thermal devices integrated with thermoelectric modules with applications to CPU cooling
    • presented at the, San Francisco, CA
    • I. Sauciuc, H. Erturk, G. Chrysler, V. Bala, and R. Mahajan, "Thermal devices integrated with thermoelectric modules with applications to CPU cooling," presented at the ASME InterPACK, San Francisco, CA, 2005.
    • (2005) ASME InterPACK
    • Sauciuc, I.1    Erturk, H.2    Chrysler, G.3    Bala, V.4    Mahajan, R.5
  • 24
    • 16544377463 scopus 로고    scopus 로고
    • Challenges in electronic cooling - Opportunities for enhanced thermal management techniques - Microprocessor liquid cooled minichannel heat sink
    • R. Schmidt, "Challenges in electronic cooling - Opportunities for enhanced thermal management techniques - Microprocessor liquid cooled minichannel heat sink," Heat Transfer Eng., vol. 25, no. 3, pp. 3-12, 2004.
    • (2004) Heat Transfer Eng , vol.25 , Issue.3 , pp. 3-12
    • Schmidt, R.1
  • 26
    • 4344632455 scopus 로고    scopus 로고
    • An integrated digital microfluidic lab-on-a-chip for clinical diagnostics on human physiological fluids
    • V. Srinivasan, V. K. Pamula, and R. B. Fair, "An integrated digital microfluidic lab-on-a-chip for clinical diagnostics on human physiological fluids," Lab on a Chip, vol. 4, pp. 310-315, 2004.
    • (2004) Lab on a Chip , vol.4 , pp. 310-315
    • Srinivasan, V.1    Pamula, V.K.2    Fair, R.B.3
  • 27
    • 16644373900 scopus 로고    scopus 로고
    • Protein stamping for maldi mass spectrometry using an electrowetting-based microfluidic platform
    • V. Srinivasan et al., "Protein stamping for maldi mass spectrometry using an electrowetting-based microfluidic platform," in Lab on a Chip: Platforms, Devices, Appl., Conf. 5591, SPIE Optics East, 2004, pp. 26-32.
    • (2004) Lab on a Chip: Platforms, Devices, Appl., Conf. 5591, SPIE Optics East , pp. 26-32
    • Srinivasan, V.1
  • 29
    • 0033871060 scopus 로고    scopus 로고
    • Cell-level placement for improving substrate thermal distribution
    • Feb
    • S. H. and S. M. Kang, "Cell-level placement for improving substrate thermal distribution," IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol. 19, no. 2, pp. 253-266, Feb. 2000.
    • (2000) IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst , vol.19 , Issue.2 , pp. 253-266
    • Tsai, C.-H.1    Kang, S.M.2
  • 30
    • 0019563707 scopus 로고
    • High-performance heat sinking for VLSI
    • May
    • D. B. Tuckerman and R. F. W. Pease, "High-performance heat sinking for VLSI," IEEE Electron Device Lett., vol. 2, no. 5, pp. 126-129, May 1981.
    • (1981) IEEE Electron Device Lett , vol.2 , Issue.5 , pp. 126-129
    • Tuckerman, D.B.1    Pease, R.F.W.2
  • 31
    • 0032674327 scopus 로고    scopus 로고
    • Micro heat exchanger by using MEMS impinging jets
    • S. Wu, J. Mai, Y. C. Tai, and C. M. Ho, "Micro heat exchanger by using MEMS impinging jets," in Proc. IEEE MEMS Conf., 1999, pp. 171-176.
    • (1999) Proc. IEEE MEMS Conf , pp. 171-176
    • Wu, S.1    Mai, J.2    Tai, Y.C.3    Ho, C.M.4
  • 33
    • 14544308245 scopus 로고    scopus 로고
    • Single-phase liquid cooled microchannel heat sink for electronic packages
    • H. Y. Zhang, D. Pinjala, T. N. Wong, K. C. Toh, and Y. K. Joshi, "Single-phase liquid cooled microchannel heat sink for electronic packages," Appl. Thermal Eng., vol. 25, pp. 1472-1487, 2005.
    • (2005) Appl. Thermal Eng , vol.25 , pp. 1472-1487
    • Zhang, H.Y.1    Pinjala, D.2    Wong, T.N.3    Toh, K.C.4    Joshi, Y.K.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.