Smart pumpless loop for micro-channel electronic cooling using flat and enhanced surfaces

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 99-109

  Mukherjee, Swaraj ^a   Mudawar, Issam ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Boiling; Critical heat flux; High heat flux; Microchannel; Passive cooling; Phase change; Pressure drop; Pumpless loop

Indexed keywords

DIELECTRIC PROPERTIES; FINS (HEAT EXCHANGE); HEAT FLUX; MICROELECTRONICS; PASSIVE NETWORKS; PRESSURE EFFECTS;

CRITICAL HEAT FLUX; DIELECTRIC COOLANTS; HIGH HEAT FLUX; MICROCHANNEL ELECTRONIC COOLING; PASSIVE COOLING; SMART PUMPLESS LOOP;

COOLING SYSTEMS;

EID: 0038819124     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.811478     Document Type: Article

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