Thermal effects on droplet transport in digitial microfluidics with applications to chip cooling

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 649-654

  Paik, Phil ^a   Pamula, Vamsee K ^a   Chakrabarty, Krishnendu ^a  

^a Duke University   (United States)

Author keywords

Active cooling; Chip cooling; Digital microfluidics; Droplet; Electrowetting; Microfluidics; Nanoliter; Smart cooling; Thermal effects

Indexed keywords

CHIP COOLING; DIGITAL MICROFLUIDICS; DROPLET; ELECTROWETTING; MICROFLUIDICS;

COOLING; ELECTRIC POTENTIAL; ENERGY DISSIPATION; HEAT TRANSFER; HIGH TEMPERATURE EFFECTS; MICROPROCESSOR CHIPS; PRINTED CIRCUIT DESIGN; STATISTICAL METHODS; SURFACE TENSION; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS; VISCOSITY MEASUREMENT;

INTEGRATED CIRCUITS;

EID: 4444299328     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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