Micro heat exchanger by using MEMS impinging jets

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1999, Pages 171-176

  Wu, S ^a   Mai, J ^a   Tai, Y C ^a   Ho, C M ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; JETS; MICROELECTROMECHANICAL DEVICES; NOZZLES; TEMPERATURE MEASUREMENT;

MICROHEAT EXCHANGERS; TEMPERATURE SENSORS;

HEAT EXCHANGERS;

EID: 0032674327     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/memsys.1999.746799     Document Type: Conference Paper

References (3)