Interactions of photoresist stripping plasmas with nanoporous organo-silicate ultra low dielectric constant dielectrics

Thin Solid Films

Volumn 516, Issue 11, 2008, Pages 3697-3703

  Lazzeri, P ^a   Oehrlein, G S ^b   Stueber, G J ^b   McGowan, R ^c   Busch, E ^c   Pederzoli, S ^a   Jeynes, C ^d   Bersani, M ^a   Anderle, M ^a  

^a ITC IRST   (Italy)

^b UNIVERSITY OF MARYLAND   (United States)

^c SEMATECH   (United States)

^d UNIVERSITY OF SURREY   (United Kingdom)

Author keywords

Ashing; Damage; Dielectric; Low k; Organo silicate; Plasma; Stripping; ToF SIMS

Indexed keywords

DIELECTRIC MATERIALS; PERMITTIVITY; PLASMAS;

ASHING; ORGANO-SILICATES; STRIPPING;

PHOTORESISTS;

EID: 40649102678     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.08.043     Document Type: Article

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