Process integration compatibility of low- k and ultra-low- k dielectrics

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 23, Issue 1, 2005, Pages 332-335

  Moore, Darren ^a   Carter, Richard ^a   Cui, Hao ^a   Burke, Peter ^a   McGrath, Peter ^a   Gu, S Q ^a   Gidley, David ^b   Peng, Huagen ^b  

^a AGERE SYSTEMS   (United States)

^b UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PLASMA ASH; WET CLEAN PROCESSES;

PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA ETCHING; POROSITY; SILICA; SILICON CARBIDE;

DIELECTRIC FILMS;

EID: 31144454356     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1835315     Document Type: Article

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