메뉴 건너뛰기




Volumn 78, Issue 2, 2003, Pages 459-463

Kinetic behaviour of diffusion-soldered Ni/Al/Ni interconnections

Author keywords

Diffusion soldering; Interdiffusion coefficient; Intermetallic phases; Isothermal solidification; Ni Al system

Indexed keywords

DIFFUSION; GROWTH (MATERIALS); INTERMETALLICS; NICKEL COMPOUNDS; RATE CONSTANTS; SOLIDIFICATION; STOICHIOMETRY;

EID: 0037449990     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(02)00232-8     Document Type: Article
Times cited : (51)

References (18)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.