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Volumn 78, Issue 2, 2003, Pages 459-463
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Kinetic behaviour of diffusion-soldered Ni/Al/Ni interconnections
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Author keywords
Diffusion soldering; Interdiffusion coefficient; Intermetallic phases; Isothermal solidification; Ni Al system
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Indexed keywords
DIFFUSION;
GROWTH (MATERIALS);
INTERMETALLICS;
NICKEL COMPOUNDS;
RATE CONSTANTS;
SOLIDIFICATION;
STOICHIOMETRY;
DIFFUSION SOLDERING;
SOLDERING;
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EID: 0037449990
PISSN: 02540584
EISSN: None
Source Type: Journal
DOI: 10.1016/S0254-0584(02)00232-8 Document Type: Article |
Times cited : (51)
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References (18)
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