Investigation of relation between intermetallic and tin whisker growths under ambient condition

Microelectronics Reliability

Volumn 48, Issue 1, 2008, Pages 111-118

  Kim, K S ^a   Yu, C H ^b   Han, S W ^c   Yang, K C ^c   Kim, J H ^d  

^a Yeojoo Institute of Technology   (South Korea)

^b Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^c Chung Ang University   (South Korea)

^d Chonnam National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CRYSTAL MICROSTRUCTURE; GRAIN BOUNDARIES; TIN; TRANSMISSION ELECTRON MICROSCOPY;

IMC GROWTH; ROOT MEAN SQUARE (RMS); TIN WHISKER GROWTHS;

INTERMETALLICS;

EID: 39149116399     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.01.088     Document Type: Article

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