A global-local approach for mechanical deformation and fatigue durability of microelectronic packaging systems

Journal of Electronic Packaging

Volumn 129, Issue 2, 2007, Pages 179-189

  Zhang, T ^a   Rahman, S ^a   Choi, K K ^a   Cho, K ^b   Baker, P ^b   Shakil, M ^b   Heitkamp, D ^b  

^a University of Iowa   (United States)

^b ROCKWELL COLLINS   (United States)

Author keywords

Equivalent model; Fatigue crack initiation; Global local; HASMAP; Moir interferometry; Submodel

Indexed keywords

BALL GRID ARRAYS; COMPUTER SIMULATION; DEFORMATION; DURABILITY; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; GLOBAL OPTIMIZATION; MOIRE FRINGES; THERMAL LOAD;

FATIGUE DURABILITY; FATIGUE LIFE ANALYSIS; SUPER BALL GRID ARRAY (SBGA) PACKAGES;

MICROELECTRONICS;

EID: 38749149549     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2721092     Document Type: Article

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