Reliability modeling for ball grid array assembly with a large number of warpage affected solder joints

Journal of Electronic Packaging

Volumn 124, Issue 3, 2002, Pages 246-253

  Chan, Y W ^a   Ju, T H ^a   Hareb, Saeed A ^a   Lee, Y C ^a   Wu, Jih Shun ^b   Lii, Mirng Ji ^c  

^a UCB 450   (United States)

^b Semi Custom Design and Manufacturing   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042872381     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1451844     Document Type: Article

References (17)

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3. Patra, S. K., Sritharan, S. S., and Lee, Y. C., 1995, "Minimum-Energy Surface Shape of Solder Joints for Non-circular Pads," ASME J. Appl. Mech., 115, June, pp. 390-397.
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5. Brakke, K. A., 1994, Surface Evolver Manual, version 1.94, University of Minnesota, Geometry Center.
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9. McKeown, S. A., 1993, "Solder Life Prediction of Leadless and Leaded Surface Mount Components under Thermal Cycling and Vibration," EEP-Vol. 4-2, ASME Advances in Electronic Packaging, pp. 987-994.
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11. Borgessen, P., Li, C. Y., and Conway, H. D., 1992, "Analytical Estimates of Thermally Induced Stresses and Strains in Flip-Chip Solder Joints," Advances in Electronic Packaging, pp. 845-854.
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17. Chan, Yiu-Wai Andy, 1995, "An Integrated Model for Ball Grid Array/flip-chip Solder Joints Reliability," M.S. thesis, University of Colorado, Boulder, CO.