Micro to macro thermo-mechanical simulation of wafer level packaging

Journal of Electronic Packaging

Volumn 125, Issue 4, 2003, Pages 576-581

  Yuan, Chang An ^a   Chiang, Kou Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER HARDWARE; COMPUTER SIMULATION; ELASTICITY; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; OPTIMIZATION; REGRESSION ANALYSIS; RELIABILITY THEORY; SILICON WAFERS; SOLDERED JOINTS;

EQUIVALENT BEAM METHOD; MULTI-POINT CONSTRAINT METHOD; THREE DIMENSIONAL SOLDER JOINT; WAFER LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 0348197101     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1604159     Document Type: Article

References (13)

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