An effective approach for three-dimensional finite element analysis of ball grid array typed packages

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 2, 1998, Pages 129-134

  Cheng, H C ^a   Chiang, K N ^a   Lee, M H ^a  

^a NATIONAL CENTER FOR HIGH PERFORMANCE COMPUTING   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; MATHEMATICAL MODELS; OPTIMIZATION; SOLDERING;

BALL GRID ARRAY PACKAGING;

ELECTRONICS PACKAGING;

EID: 0032096802     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792597     Document Type: Article

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