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Volumn , Issue , 2004, Pages 593-598

Mechanical properties of molding compounds (MCs) under different moisture conditions and in a wide temperature range

Author keywords

Flexural modulus; Fracture toughness; Green molding compound; Moisture effect; Rapture stress; Temperature effect

Indexed keywords

FLEXURAL MODULUS; GREEN MOLDING COMPOUNDS; MOISTURE EFFECTS; RAPTURE STRESSES;

EID: 3843144975     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (8)

References (13)
  • 1
    • 0029698860 scopus 로고    scopus 로고
    • Effect of mold compound properties on lead-on-chip (LOC) package reliability during IR reflow
    • Yang J., Leong C., et al, "Effect of mold compound properties on lead-on-chip (LOC) package reliability during IR reflow", Proc. of 46th Electronic Components and Technology Conf. 1996, pp. 48-55.
    • (1996) Proc. of 46th Electronic Components and Technology Conf. , pp. 48-55
    • Yang, J.1    Leong, C.2
  • 2
    • 0038088004 scopus 로고    scopus 로고
    • Dynamics of moisture diffusion, hygrothermal stresses and delamination in plastic IC packages
    • Lin T.Y. and Tay A. A.O., " Dynamics of moisture diffusion, hygrothermal stresses and delamination in plastic IC packages", Proc of ASME Adv. Electronic Packaging, 1997, pp. 1429-1436.
    • (1997) Proc of ASME Adv. Electronic Packaging , pp. 1429-1436
    • Lin, T.Y.1    Tay, A.A.O.2
  • 3
    • 0030686949 scopus 로고    scopus 로고
    • Evaluation of interface delamination in IC packages by considering swelling of the molding compound due to moisture absorption
    • Tanaka N., Kitano M., Kumazawa T. and Nishimura A., " Evaluation of interface delamination in IC packages by considering swelling of the molding compound due to moisture absorption", Proc. of 47th Electronic Components and Technology Conf., 1997, pp.84-90.
    • (1997) Proc. of 47th Electronic Components and Technology Conf. , pp. 84-90
    • Tanaka, N.1    Kitano, M.2    Kumazawa, T.3    Nishimura, A.4
  • 5
    • 0031620466 scopus 로고    scopus 로고
    • Moisture induced interfacial delamination growth in plastic IC packages during solder reflow
    • Tay A.A.O. and Lin T.Y., "Moisture induced interfacial delamination growth in plastic IC packages during solder reflow", Proc. of 48th Electronic Components and Technology Conf., 1998, pp.371-378.
    • (1998) Proc. of 48th Electronic Components and Technology Conf. , pp. 371-378
    • Tay, A.A.O.1    Lin, T.Y.2
  • 7
    • 0038481213 scopus 로고    scopus 로고
    • Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging
    • Haleh Ardebili, Wong E.H. and Michael G. Pecht, " Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging", IEEE Transactions on Components and Packaging Technologies, Vol. 26, No.1, 2003, pp.206-214.
    • (2003) IEEE Transactions on Components and Packaging Technologies , vol.26 , Issue.1 , pp. 206-214
    • Ardebili, H.1    Wong, E.H.2    Pecht, M.G.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.