Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 163-169

  Lin, T Y ^a   Tay, A A O ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; DELAMINATION; INTERFACES (MATERIALS); PLASTICS APPLICATIONS; SOLDERING; STRESS INTENSITY FACTORS; THERMAL STRESS;

HYGROTHERMAL STRESSES; INTERFACIAL DELAMINATION;

ELECTRONICS PACKAGING;

EID: 0031323701     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)