Virtual qualification of moisture induced failures of advanced packages

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 157-162

  Van Gils, M A J ^a   Van Driel, W D ^b   Zhang, G Q ^c   Bressers, H J L ^b   Van Silfhout, R B R ^a   Fan, X J ^a   Janssen, J H J ^b  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

^c EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; COMPUTER SIMULATION; DIFFUSION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; STRESS ANALYSIS; SWELLING; THERMAL EXPANSION; THERMOANALYSIS;

COEFFICIENT OF THERMAL EXPANSION (CTE); MOISTURE DIFFUSION; MOISTURE FAILURES; PLASTIC STRAINS;

MOISTURE;

EID: 3843130708     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

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