Whole field vapor pressure modeling of QFN during reflow with coupled hygro-mechanical and thermo-mechanical stresses

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1552-1559

  Tee, Tong Yan ^a   Ng, Hun Shen ^a  

^a STMICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

HYGRO-MECHANICAL STRESS; THERMO-MECHANICAL STRESS;

ABSORPTION; ADHESION; DESORPTION; DIFFUSION; FAILURE ANALYSIS; HEAT TRANSFER; MOISTURE; STRAIN; SWELLING; THERMAL STRESS; VAPOR PRESSURE;

ELECTRONICS PACKAGING;

EID: 0036283842     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2002.1008314     Document Type: Conference Paper

References (13)

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8. Modeling of Whole field vapor pressure during reflow for flip chip BGA and wire bond PBGA packages
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13. Comprehensive treatment of moisture induced failure in IC packaging