On wire failures in micro-electronic packages

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 53-57

  Van Driel, W D ^a   Janssen, J H J ^a   Van Silfhout, R B R ^b   Van Gils, M A J ^b   Zhang, G Q ^b   Ernst, L J ^c  

^a NXP SEMICONDUCTORS   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DELAMINATION; ELECTRIC WIRE; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; INTERFACES (MATERIALS); OPTIMIZATION;

INTERFACIAL DELAMINATION; MATERIALS SELECTION; THERMO-MECHANICAL FAILURES; WEDGE BONDING;

MICROELECTRONICS;

EID: 3843138371     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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