Cooling problems and thermal issues in high power electronics - A multi faceted design approach

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 519-526

  Behnia, Masud ^a   Maguire, Luke ^b   Morrison, Graham ^b  

^a UNIVERSITY OF SYDNEY   (Australia)

^b UNIVERSITY OF NEW SOUTH WALES   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COOLING SYSTEMS; COST EFFECTIVENESS; ELECTRONIC EQUIPMENT; FLOW VISUALIZATION; HEAT FLUX; HEAT LOSSES; HEAT RESISTANCE; MARKETING; MICROPROCESSOR CHIPS; NUMERICAL ANALYSIS; PERSONAL COMPUTERS; SEMICONDUCTOR MATERIALS; THERMAL EFFECTS; THERMOANALYSIS;

AIR COOLING; HEAT GENERATION; POWER CONSUMPTION; THERMAL DESIGNERS;

POWER ELECTRONICS;

EID: 3843057908     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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