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Volumn 2, Issue , 2003, Pages 159-166
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Dynamic Characterization of Thermal Interface Material for Electronic Cooling
a
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Author keywords
[No Author keywords available]
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Indexed keywords
AUTOMATIC TESTING;
CORRELATION METHODS;
FILLERS;
HEAT RESISTANCE;
HEAT TRANSFER;
INTERFACES (MATERIALS);
PRODUCT DEVELOPMENT;
STANDARDS;
THERMAL CONDUCTIVITY;
AUTOMATION;
ELECTRONICS PACKAGING;
FATIGUE OF MATERIALS;
INSTRUMENT TESTING;
MANUFACTURE;
MATERIALS TESTING;
STANDARDIZATION;
TESTING;
THERMAL INSULATING MATERIALS;
THERMAL INTERFACE MATERIALS (TIM);
THERMAL PERFORMANCE;
APPROPRIATE MATERIALS;
AUTOMATED TEST;
DESIGN AND CONSTRUCTION;
DYNAMIC CHARACTERIZATION;
ELECTRONIC COOLING;
END USERS;
HOT BLOCK;
INDUSTRIAL STANDARDS;
INTERFACE MATERIALS;
NONUNIFORM HEATING;
OPERATOR INTERVENTIONS;
STANDARDIZED TESTING;
TEST METHOD;
TEST SYSTEMS;
THERMAL INTERFACE MATERIALS;
THERMAL RESISTANCE;
COOLING;
MATERIALS;
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EID: 1242309433
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1115/ipack2003-35073 Document Type: Conference Paper |
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Times cited : (5)
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References (7)
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