Optimization of pin-fin heat sinks for impingement coolingof electronic packages

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 3, 2000, Pages 240-246

  Kondo, Y ^a   Matsushima, H ^a   Komatsu, T ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0040489250     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.1289761     Document Type: Article

References (19)

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