An experimental and computational study of heat transfer in high power amplifiers

Heat Transfer Engineering

Volumn 26, Issue 2, 2005, Pages 81-92

  Maguire, Luke ^a   Behnia, Masud ^a,b   Morrison, Graham ^a  

^a UNIVERSITY OF NEW SOUTH WALES   (Australia)

^b UNIVERSITY OF SYDNEY   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; HEAT SINKS; NATURAL FREQUENCIES; POWER AMPLIFIERS; PRESSURE DROP; SEMICONDUCTOR JUNCTIONS; SIGNAL THEORY; TELECOMMUNICATION INDUSTRY; TRANSMITTERS;

PRIMARY TRANSISTORS; RADIOFREQUENCY TRANSMITTERS; SIGNAL TRANSMISSION;

HEAT TRANSFER;

EID: 13844267570     PISSN: 01457632     EISSN: None     Source Type: Journal    
DOI: 10.1080/01457630590897295     Document Type: Article

References (12)

1. Kondo, Y., Behnia, M., Nakayama, W., and Matsushima, H., Optimisation of Finned Heat Sinks for Impingement Cooling of Electronic Packages, Journal of Electronic Packaging, vol. 120, pp. 259-266, 1998.
2. Kondo, Y., Matsushima, H., and Komatsu, T., Optimisation of Pinfin Heat Sinks for Impingement Cooling of Electronic Package, Journal of Electronic Packaging, vol. 122, pp. 240-246, 2000.
3. Behnia, M., Copeland, D., and Soodphakdee, D., A Comparison of Heat Sink Geometries for Laminar Forced Convection: Numerical Simulation of Periodically Developed Flow, Proc. 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Seattle, pp. 310-315, 1998.
4. Behnia, M., Soodphakdee, D., and Copeland, D., Optimisation of Staggered Plate Fin Heat Sinks for Laminar Forced Convection Using Two-dimensional CFD Simulations, Proc. International Systems Packaging Symposium, San Diego, pp. 83-88, 1999.
5. Soodphakdee, D., Behnia, M., and Copeland, D., A CFD-based Optimisation Procedure and Correlation Development for Staggered Plate Fin Heat Sink, Proc. 4th ASME Heat and Mass Transfer Conference, Pune, pp. 805-810, 2000.
6. Linton, R.L., and Agonafer, D., Coarse and Detailed CFD Modeling of a Finned Heat Sink, IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 18, no. 3, pp. 517-520, 1995.
7. Jonsson, H., and Palm, B., Thermal and Hydraulic Behavior of Plate Fin and Strip Fin Heat Sinks under Varying Bypass Conditions, Proc. 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Seattle, pp. 96-103, 1998.
8. Jonsson, H., and Moshfegh, B., Modeling of the Thermal and Hydraulic Performance of Plate Fin, Strip Fin, and Pin Fin Heat Sinks - Influence of Flow Bypass, IEEE Transactions on Components and Packaging Technologies, vol. 24, no. 2, pp. 142-149, 2001.
9. Behnia, M., Nakayama, W., and Wang, J., CFD Simulations of Heat Transfer from a Heated Module in and Air Stream: Comparison with Experiments and a Parametric Study, Proc. 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Seattle, pp. 143-151, 1998.
10. Li, X., Behnia, M., Nakayama, W., and Fujii, M., Air Cooling of an Electronic Module - A Comparison of Numerical Simulations and Experiments, Proc. IAMS International Seminar on Thermal Design and Management for Electronic Equipment and Material Processing, Kasuga, pp. 28-37, 2000.
11. Holman, J., Heat Transfer, 8th ed., p. 47, McGraw-Hill, New York, 1997.
12. Soodphakdee, D., Copeland, D., Take, K., Behnia, M., and Furukawa, Y., Comparison of TISE and SITE Heat Sinks - A Numerical Study, Proc. International Electronics Packaging Technical Conference and Exhibition, Kauai, pp. 1-7, 2001.