Thermal issues in microsystems packaging

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 4, 2000, Pages 602-607

  Nakayama, Wataru ^a,b  

^a IEEE

^b ThermTech International   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CLAD METALS; COMPUTER PROGRAMMING; GEOMETRY; HEAT LOSSES; HEAT TRANSFER; MICROELECTROMECHANICAL DEVICES; NATURAL CONVECTION; THERMAL CONDUCTIVITY;

ALUMINUM CLAD SYSTEMS; HEAT SPREADER; MICROSYSTEMS; MINIATURIZATION;

ELECTRONICS PACKAGING;

EID: 0034314512     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.883748     Document Type: Article

References (10)

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