Optimization of finned heat sinks for impingement cooling of electronic packages

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 3, 1998, Pages 259-266

  Kondo, Y ^a   Behnia, M ^b   Nakayama, W ^c   Matsushima, H ^a  

^a HITACHI LTD   (Japan)

^b UNIVERSITY OF NEW SOUTH WALES   (Australia)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR; COMPUTATIONAL FLUID DYNAMICS; COOLING; FINS (HEAT EXCHANGE); HEAT SINKS; LSI CIRCUITS; MATHEMATICAL MODELS; OPTIMIZATION;

FINNED HEAT SINKS;

ELECTRONICS PACKAGING;

EID: 0032163178     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792631     Document Type: Article

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