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Volumn 2, Issue , 2003, Pages 139-146
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The Development of a Bonded Fin Graphite/Epoxy Heat Sink for High Performance Servers
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Author keywords
[No Author keywords available]
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Indexed keywords
COOLING SYSTEMS;
CRACKS;
EPOXY RESINS;
GRAPHITE;
HEAT LOSSES;
METALLIC MATRIX COMPOSITES;
MICROPROCESSOR CHIPS;
PHASE INTERFACES;
SERVERS;
STRUCTURAL ANALYSIS;
TEMPERATURE DISTRIBUTION;
THERMAL CONDUCTIVITY;
THERMOCOUPLES;
ALUMINUM;
ALUMINUM ALLOYS;
FINS (HEAT EXCHANGE);
MANUFACTURE;
MULTICHIP MODULES;
RETROFITTING;
SPREADERS;
SWITCHING SYSTEMS;
THERMAL LOAD;
THERMOANALYSIS;
AIRFLOW RATES;
HEAT SPREADERS;
THERMAL MANAGEMENT SYSTEMS;
CONVECTIVE HEAT;
COPPER HEAT SINK;
COPPER HEAT SPREADER;
EDGE PROTECTION;
ENDPLATES;
FAN-SINKS;
GRAPHITE MATERIALS;
HEAT LOADS;
HIGH HEAT LOAD;
HIGH THERMAL CONDUCTIVITY;
HIGHER FREQUENCIES;
LOW DENSITY;
MANUFACTURING METHODS;
NATURAL GRAPHITE;
SHOCK AND VIBRATION;
TEMPERATURE DROPS;
THERMAL PERFORMANCE;
TWO DIRECTIONS;
WEIGHT PENALTY;
FINS (HEAT EXCHANGE);
COPPER;
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EID: 1242264422
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1115/ipack2003-35060 Document Type: Conference Paper |
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Times cited : (16)
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References (6)
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