Electromigration behavior of 60 nm dual damascene Cu interconnects

Journal of Applied Physics

Volumn 102, Issue 9, 2007, Pages

  Pyun, Jung Woo ^a   Baek, Won Chong ^a   Zhang, Lijuan ^a   Im, Jay ^a   Ho, Paul S ^a   Smith, Larry ^b   Smith, Gregory ^b  

^a The University of Texas at Austin   (United States)

^b SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; INTERFACES (MATERIALS); LINEWIDTH; MASS TRANSFER;

INTERFACIAL MASS TRANSPORT; MONOMODAL FAILURE DISTRIBUTION; TRENCH FILLING;

COPPER;

EID: 37549047238     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2805425     Document Type: Article

References (15)

1. E. Liniger, L. Gignac, C. -K. Hu, and S. Kaldor, J. Appl. Phys. 0021-8979 10.1063/1.1492871 92, 1803 (2002).
2. R. Rosenberg, D. C. Edelstein, C. -K. Hu, and K. P. Rodbell, Annu. Rev. Mater. Sci. 0084-6600 10.1146/annurev.matsci.30.1.229 30, 229 (2000).
3. K. N. Tu, J. Appl. Phys. 0021-8979 10.1063/1.1611263 94, 5451 (2003).
4. R. Havemann and J. Hutchby, Proc. IEEE 0018-9219 10.1109/5.929646 89, 586 (2001).
5. J. W. Pyun, X. Lu, S. Yoon, N. Henis, K. Neuman, K. Pfeifer, and P. S. Ho, Pproceedings of 2005 IEEE International Reliability Physics Symposium, 43th Annual, 2005, pp. 191-194.
6. E. T. Ogawa, K. -D. Lee, V. A. Blaschke, and P. S. Ho, IEEE Trans. Reliab. 0018-9529 10.1109/TR.2002.804737 51, 403 (2002).
7. C. -K. Hu, D. Canaperi, S. T. Chen, L. M. Gignac, B. Herbst, S. Kaldor, M. Krishnan, E. Liniger, D. L. Rath, D. Restaino, J. Rubino, S.-C. Seo, A. Simon, S. Smith, and W.-T. Tseng, Proceedings of 2004 IEEE International Reliability Physics Symposium, 42nd Annual, 2004, pp. 222-228.
8. J. R. Black, IEEE Trans. Electron Devices 16, 338 (1969). 0018-9383
9. J. R. Lloyd, J. Phys. D 0022-3727 10.1088/0022-3727/32/17/201 32, R109 (1999).
10. K. -D. Lee, E. T. Ogawa, S. Yoon, X. Lu, and P. S. Ho, Appl. Phys. Lett. 0003-6951 10.1063/1.1564294 82, 2032 (2003).
11. J. J. Clement and J. R. Lloyd, J. Appl. Phys. 0021-8979 10.1063/1.351204 71, 1729 (1992).
12. M. Shatzkes and J. R. Lloyd, J. Appl. Phys. 0021-8979 10.1063/1.336731 59, 3890 (1986).
13. J. R. Lloyd, J. Appl. Phys. 0021-8979 10.1063/1.347529 69, 7601 (1991).
14. A. S. Oates, Appl. Phys. Lett. 0003-6951 10.1063/1.113659 66, 1475 (1995).
15. D. Padhi and G. Dixit, J. Appl. Phys. 0021-8979 10.1063/1.1621727 94, 6463 (2003).