Adhesion characteristics of copper thin film deposited on PET substrate by electron cyclotron resonance-metal organic chemical vapor deposition

Surface and Coatings Technology

Volumn 202, Issue 9, 2008, Pages 1839-1846

  Jeon, Bup Ju ^a   Lee, Sangwha ^b   Lee, Joong Kee ^c  

^a Epon Co Ltd   (South Korea)

^b Gachon University   (South Korea)

^c Korea Institute of Science and Technology   (South Korea)

Author keywords

Adhesion; Copper; Electron cyclotron resonance; PET; Roughness

Indexed keywords

ADHESION; COPPER; ELECTRON CYCLOTRON RESONANCE; INTERFACIAL ENERGY; METALLORGANIC CHEMICAL VAPOR DEPOSITION; PLASMA POLYMERIZATION; POLYETHYLENE TEREPHTHALATES; SURFACE MORPHOLOGY; SURFACE ROUGHNESS;

ACID PRETREATMENT; ADHESION FORCE;

THIN FILMS;

ADHESION; COPPER; ELECTRON CYCLOTRON RESONANCE; INTERFACIAL ENERGY; METALLORGANIC CHEMICAL VAPOR DEPOSITION; PLASMA POLYMERIZATION; POLYETHYLENE TEREPHTHALATES; SURFACE MORPHOLOGY; SURFACE ROUGHNESS; THIN FILMS;

EID: 37449018035     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.08.015     Document Type: Article

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