Intermediate wafer level bonding and interface behavior

Microelectronics Reliability

Volumn 45, Issue 3-4, 2005, Pages 657-663

  Pan, C T ^a   Cheng, P J ^b   Chen, M F ^a   Yen, C K ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b NAN JEON INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

INFRARED IMAGING; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; MICROSTRUCTURE; PHOTOLITHOGRAPHY; PHOTORESISTS; PHOTOSENSITIVITY; POLYIMIDES; VLSI CIRCUITS;

HYDROPHILIC WAFERS; NON-INTERFACE METHOD; SILICON WAFER BONDING TECHNOLOGY; VLSI PACKAGING;

SILICON WAFERS;

EID: 15744399582     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.10.019     Document Type: Article

References (24)

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